The facets that are in the light path need to be flat and perfect like a mirror. The cleaving for this primary cut has to be done meticulously one bar at a time to achieve the required level of quality.
If your end product is not a bar, you will still need to break the bars into chips after the facet coating. Although the requirements are less demanding, however it is usually very time consuming because we are moving further away from the wafer into single chips. A lot of dicing needs to be done!
In a previous wiki we explained how a small knife can help you to place many bars on one frame. Since this is done automatically thanks to the vision system of the breaker, you don’t have to spend time manually aligning bars. Although this function is covered by the machine, it just takes time.