“Small” Yet All-Rounder Breaker And Cleaver
Description of the Breaker LDH-50TS
The LDH 50TS is the smaller breaker tool that can process wafers up to 2 inches. Despite its affordable price it does come with the high manufacturing quality and software from Opto System 100% made in Japan. The ring supporting the substrate to be diced is placed upside-down on the holder. The vision system automatically recognizes the structures and precisely aligns the wafer to the knife that hits the substrate from the back. On the front side (scribe side) a support with an adjustable gap holds the structure while letting it slightly bend over the breaking street. The sharp bending force is just about right to propragate the pre-existing crack or laser scribe along crystal planes without creating any adjacent damage. Mirror-like facets can be achieved with this method.