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Opto System Tape Cleaver LDTH-100TS

Highlights of the Opto System Tape Cleaver LDTH-100TS

Cleave Cells Into Bars With Perfect Mirror Facets.

A ceramic cutter hits the semiconductor against a stretched tape.

Dedicated Technology To Cleave Laser Diode Bars.

Or any other previously scribed material. Down to 250µm lateral chip size!

Up To 4" Wafers.

Standard set-up can fully process 4" wafers on 6" frames.

LDTH-100TS-tape-cleaver-article

Automatic Structure Recognition. Easy To Learn.

The machine vision finds the breaking street and precisely aligns the knife to it.

Highest Cleaving Yield Through Tape System.

The stretched tape holds the semiconductor tight while allowing to bend to complete the cleaving.

Optional Ring Autoloader for up to 25 Frames.

Extend the no-interaction time. Automatization for large volumes.

Our Specialized Cleaver For GaAs Or InP Edge-Emitting Laser Diodes

Description of the Opto System Tape Cleaver LDTH-100TS

The LDTH 100TS is our our dedicated laser diode cleaving tool that can process wafers up to 4 inches. The frame supporting the substrate to be cleaved is placed in the machine and a stretched tape covers the structures from above, holding them in place. The vision system automatically recognizes the structures and precisely aligns the wafer to the ceramic cutter knife that hits the substrate from the bottom. The tape holds the substrate tight but does allow a larger flexibility than our other breaking systems using an adjustable gap in a rigid support. The sharp bending force is just about right to propagate the pre-existing crack made by a diamond scriber along crystal planes without creating any adjacent damage. Mirror-like facets can be achieved with this method. If you are looking for a universal tool that can break also laser bars into chips, we recommend to have a look into our universal breakers LDH50TS and LDH100TSX instead.

FAQ

Why not getting the standard cleaver LDH 100TS?

The LDH 100TS is an excellent universal full automatic breaker with an attractive price point. If you only need to process wafers up to 2 inches, then the LDH-50TS could be a more affordable choice as well. We have a lot of customers that perform all their tasks with one of these breakers just fine. Both tools perform excellent at any cleaving and breaking task. Customers that have a large tool park and tend to assign very specific tasks to singular tools do prefer the tape cleaver LDTH 100TS for cleaving cells into bars since they report higher process control and yield for that specific processing step with the tape cleaver. For customers with a smaller tool park, the LSH 100TXS or LDH 50TS as an all-rounder breaking tool is what we usually recommend.

What is so special about the tape?

The original cleaving system in the LDTH 100TS means that the wafer is suspended between the tape it is sticked to, and the stretched tape from the tool. The stretched tape slightly presses against the wafer and holds everything in place. When the ceramic cutter strikes the semiconductor from the back, the thin semiconductor can bend quite a lot, because the tape is flexible. It is a very soft yet effective way to cleave laser bars without creating chipping and other breaking-related damage. Perfect mirror facets are very important for a good laser diode.

Do you also sell expanders and the tape?

We do provide tape and all the required consumables to run the tools smoothly. These are materials with which we have had a positive experience for very long time. If you need to use a specific type of tape we will be happy to try it out and optimize the parameters for that specific set. We do not offer expander tools right now but we are happy to share information about possible vendors.

Do you process my wafers?

Right now we do not have the capability to act as an OEM manufacturer but we are looking for partners to be able to do so in the future. If you want to try out how our tools work on your devices, please get in touch and send us some samples. We are eager to show off and learn about new applications. If you own OptoSystem tools and would like to offer OEM services, please get in touch too!

“custom half automatic operation mode”??

This cleaver has a machine vision system, motors and sensors that allow a full automatic operation of a full wafer from beginning til end. Add the autoloader and up to 25 wafers can be processed at once. The breaker has also a joystick and index buttons to manually move and rotate the wafer, a monitor to see what the cameras see and perform all tasks manually while avoiding damaging the tool unintentionally. This allows a huge flexibility when trying something out in a very efficient way, because you choose which steps should run automatically and which steps should be done manually. All these settings can be saved as a recipe as well.

What are the critical process parameters?

A deep hands-on training at your location is part of our delivery. Prior to to that, it is best if you contact us and send us some samples.  Our engineers will be happy as well to discuss your specific needs and share their decade long expertise with you. Besides, we are building a Wiki site to collect experiences with our tools on this website. You can consult those basics on your own right here right now!

Why Opto System?

Opto System’s tools are built to last and very robust with a focus on performance and quality. Opto System has been around for for more than 40 years and has earned a reputation for excellent tools in the semiconductor industry across the world.

Who or What is Tomosemi?

TomoSemi is a manufacturer’s representative appointed by Opto System to promote Opto System’s products and to help customers in Europe since we are local.

Contact​

Phone: + 49.15678 719 479
Email: sales@tomosemi.com

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