Scribe and Break tools from Opto System Co. Ltd
Tools for dicing edge emitting laser diode wafers into individual bars or chips.

Scribe and Break tools from Opto System

Probably The most commonly used tools for dicing edge emitting laser diode wafers into individual bars or chips.

diamond scriber OptoSystem OSM-100TS

Opto System Diamond Scriber OSM-100TS

The full-automatic diamond scriber is a standard in laser fabs across the world. It features a machine vision system and a diamond tip with motorized angle and a control mechanism for the applied force. It is the perfect choice for GaAs and InP substrates.

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Opto System Laser Scriber WSF 4000

This laser scriber is probably the most used in the laser diode industry for up to 4″ GaN, sapphire or Si wafers. It is the best choice when the substrate does not have a cubic lattice structure since it does not depend on cracks but on thermal ablation.

OPTO SYSTEM LASER SCRIBER WSF6000

This laser scriber is probably the most used in the laser diode industry for up to 6″ GaN, Sapphire or Si wafers. It is the best choice when the substrate does not have a cubic lattice structure because it does not depend on cracks but on thermal ablation.

Opto System Laser Scriber WSF8000

This laser scriber is probably the most used in the laser diode industry for up to 8″ GaN, Sapphire or Si wafers. It is the best choice when the substrate does not have a cubic lattice structure because it does not depend on cracks but on thermal ablation.

Opto System Breaker ldh-100tsx

This tool is our most versatile breaker used for dicing pre-scribed substrates of any kind. It is often used as a stand-alone tool for all typical breaking applications including the cleaving of the facets. The maximum wafer size is 4 inches.

Opto System Breaker ldh-50ts

This tool is our most versatile and affordable breaker used for dicing pre-scribed substrates of any kind. It is often used as a stand-alone tool for all typical breaking applications including the cleaving of the facets. The maximum wafer size is 2 inches.

OptoSystem Tape Cleaver LDTH-100TS

Opto System Tape Cleaver LDTH-100TS

The tape cleaver features a special cleaving method for our most demanding customers. It is optimized for GaAs and InP laser diode cleaving with the highest expectations on facet quality and yield.

Opto System Wafer Breaker WBS 4000

The wafer breaker from Opto System has been developed to break very hard substrates such as sapphire, SiC, Glass, etc. It is also used to break substrates that are too thick for other tools.

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