Opto System Diamond Scriber OSM-150TS

Highlights of the Opto System Diamond Scriber OSM-150TS

For wafer to cells, cells to bars, bars to chips...

or whichever precision scribe job you have in mind that you want to perform with a diamond tip.

For GaAs, InP other III/V zincblende lattices.

The considerable pressure of the diamond tip cracks cubic crystals along the desired planes.

Up to 6" wafers.

Standard set-up can fully process whole 6” wafers placed on 8” frames. Ask us for larger wafers.

Automatic Structure Recognition. Easy to Learn.

Outstanding machine vision system with a powerful yet easy to operate interface offers endless possibilities.

Automatic Wafer Alignment To Flat And Structures.

Focus on the physics of your process. Rely on a high precision tool for repetitive tasks.

Optional Ring Autoloader for up to 25 Frames.

Extend the no-interaction time. Automatization for large volumes.

Scribes At Your Diamond Tips For 6" Wafers

Description of the Diamond scriber OSM-150TS

The 6 inch diamond scriber from Opto System is the latest evolution of a classic equipment in laser diode manufacturing. Designed for high-volume production environments, this diamond scriber is already in operation at large InP fabs serving the data center industry. The diamond scriber is your formula for success as separating your dies by other methods may damage your valuable facets. The diamond scriber automatically recognizes your structures and moves the wafer to the diamond tip with high speed but precision. The diamond tip is adjusted automatically at the exact angle for optimum results and pressed against the semiconductor while moving it at a controlled speed and pressure. The inflicted pressure creates a system of cracks that go deep into the semiconductor and will induce a perfect cleave along the crystal planes. This works best on cubic crystals such as the zincblende cubic crystal structure of GaAs and InP. With optional fully automatic magazine handling, the 6 inch diamond scriber enables continuous production of large III-V substrates including InP and GaAs wafers with minimal operator intervention.

FAQ

Why not a laser scriber?

 For III/V compound semiconductors in the zincblende structure, such as GaAs and InP, the diamond scriber delivers deeper cracks along the crystal planes and at the same time the damage on adjacent areas is smaller than with the laser scriber. A laser scriber delivers better results if the direction of the median crack is difficult to control or if the crystal has many defects. If you are not separating dices for edge-emitter lasers and the facets do not need to be mirror-like, the choice of the dicing method is less constrained. In this case, a diamond scriber might as well provide satisfactory results on Si, GaN and other materials and it can be used as a dry dicing method. A laser scriber is less flexible because the laser wavelength is fix and each material needs a different wavelength for scribing.

“custom half automatic operation mode”??

This scribing machine has a machine vision system, motors and sensors that allow a full automatic operation of a full wafer from beginning til end. Add the autoloader and up to 25 wafers can be processed at once.

On the other side, the diamond scriber has also a joystick and index buttons to manually move and rotate the wafer, a monitor to see what the cameras see, and the ability to perform all tasks manually while avoiding damaging the tool unintentionally. This allows a huge flexibility when trying something out in a very efficient way, because you choose which steps should run automatically and which steps should be done manually. All these settings can be saved as a recipe as well.

Do you provide diamond tips as an aftersales service? What about for other machines?

We support your lifelong supply of diamond tips on Opto System tools only. For tips that work on other manufacturer’s tools, please contact us to discuss the possibilities.

Which diamond tip configurations does this diamond scriber support?

Any diamond tip configuration is possible. Opto System has experience both with toe and with heel scribing. We provide diamond tips cut to 3 points, 4 points and 8 points. Our engineers will discuss with you different approaches. The machine is very easy to adjust to different diamond tip settings for different materials.

Do you Process my wafers ?

Right now we do not have the capability to act as an OEM manufacturer but we are looking for partners to be able to do so in the future. If you want to try out how our tools work on your devices, you are invited to send us some samples. We are eager to show off and learn about new applications. If you own OptoSystem tools and would like to offer OEM services, please get in touch too!

What are the critical process parameters?

A deep hands-on training at your location is part of our delivery. Prior to that, it is best if you contact us and send us some samples.  Our engineers will be happy as well to discuss your specific needs and share their decade long expertise with you. Besides, we are building a Wiki site to collect experiences with our tools on this website. You can consult those basics on your own right here right now!

Why Opto System?

Opto System’s tools are built to last and very robust with a focus on performance and quality. Opto System has been around for for more than 40 years and has earned a reputation for excellent tools in the semiconductor industry across the world.

Who or What is Tomosemi?

TomoSemi is a manufacturer’s representative appointed by Opto System to promote Opto System’s products and to help customers in Europe since we are local.

Contact​

Phone: + 49.15678 719 479
Email: sales@tomosemi.com

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